Available Technologies - Search Results
| Title: | High Speed Circuit Board Writing |
|---|---|
| UC Case No: | 2000-442-2-ott |
| Categories: |
Electrical Engineering:
Sensors, Transducers, Electronic Components
Computer Technology: Hardware |
| Technology: | A method of printing lines on circuit boards from computer information in a manner similar to using an inkjet printer. Utilizing capillary stream break-up of molten metal droplets, this novel approach is capable of printing very fine lines on the order of 10 microns wide and many centimeters long at very high speed, thus resulting in a system that is faster and cheaper than other current methods of circuit board writing such as traditional etching, chemical vapor deposition, focused ion beam writing, micropen direct write, and drop-on-demand dispensing system. |
| Contact: |
Demetrios Andrikos, Director, Engineering & Physical Sciences Office of Technology Alliances University of California, Irvine 380 University Tower Irvine, CA 92697-7700 Phone: (949) 824-1233 FAX: (949) 824-2899 Email: dandriko@uci.edu |
| Patent Status: | U.S. Patent No. 6,520,402 |
| UCI School: | School of Engineering |
| Department: | Mechanical & Aerospace Engineering |
